TPSM53603RDAR

Texas Instruments
595-TPSM53603RDAR
TPSM53603RDAR

Mfr.:

Description:
Power Management Modules 36-V 3-A step-down p ower module in smal

ECAD Model:
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In Stock: 1.978

Stock:
1.978
Can Dispatch Immediately
On Order:
4.000
Expected 6/25/2026
Factory Lead Time:
12
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 1000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
8,81 € 8,81 €
7,42 € 74,20 €
6,93 € 173,25 €
6,22 € 622,00 €
6,03 € 1.507,50 €
5,74 € 2.870,00 €
Full Reel (Order in multiples of 1000)
5,03 € 5.030,00 €
5,00 € 10.000,00 €
5.000 Quote
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Power Management Modules
RoHS:  
Non-Isolated / PoL
36 V
Brand: Texas Instruments
Input Voltage - Min: 3.8 V
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
Moisture Sensitive: Yes
Packaging: Reel
Packaging: Cut Tape
Packaging: MouseReel
Product Type: Power Management Modules
Series: TPSM53603
Factory Pack Quantity: 1000
Subcategory: Embedded Solutions
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Compliance Codes
CNHTS:
8504401400
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
China
Country of Diffusion:
United States
The country is subject to change at the time of shipment.

TPSM5360x Power Modules

Texas Instruments TPSM5360x Power Modules are highly integrated 2A (TPSM53602), 3A (TPSM53603) or 4A (TPSM53604) power solutions with a 36V input. Each device combines a step-down DC/DC converter with power MOSFETs, a shielded inductor and passives in a thermally enhanced QFN package. The 5mmx5.5mmx4mm, 15-pin QFN package uses routable lead-frame technology for improved thermal performance, a  small footprint and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for a simple layout and easy handling in manufacturing.