DP83869HMRGZR

Texas Instruments
595-DP83869HMRGZR
DP83869HMRGZR

Mfr.:

Description:
Ethernet ICs Extended temperature high-immunity giga A 595-DP83869HMRGZT

ECAD Model:
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In Stock: 3.821

Stock:
3.821 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
12,24 € 12,24 €
9,64 € 96,40 €
8,99 € 224,75 €
8,27 € 827,00 €
7,94 € 1.985,00 €
7,73 € 3.865,00 €
7,56 € 7.560,00 €
Full Reel (Order in multiples of 2000)
7,56 € 15.120,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Alternative Packaging

Mfr. Part No.:
Packaging:
Reel, Cut Tape, MouseReel
Availability:
In Stock
Price:
14,38 €
Min:
1

Similar Product

Texas Instruments DP83869HMRGZT
Texas Instruments
Ethernet ICs Extended temperature high-immunity giga A 595-DP83869HMRGZR

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Ethernet ICs
RoHS:  
SMD/SMT
VQFN-48
Ethernet Transceivers
10BASE-TE, 100BASE-TX, 1GBASE-T
1 Transceiver
MII, RGMII, SGMII
1.8 V
3.45 V
- 40 C
+ 125 C
DP83869HM
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Moisture Sensitive: Yes
Product Type: Ethernet ICs
Factory Pack Quantity: 2000
Subcategory: Communication & Networking ICs
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Attributes selected: 0

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CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

DP83869HM Gigabit Physical Layer (PHY) Transceiver

Texas Instruments DP83869HM Gigabit Physical Layer (PHY) Transceiver has integrated PMD sublayers that support 10BASE-Te, 100BASE-TX, and 1000BASE-T Ethernet protocols. The DP83869 also supports 1000BASE-X and 100BASE-FX Fiber protocols. Optimized for ESD protection, the Texas Instruments DP83869HM exceeds 8kV IEC 61000-4-2 (direct contact). This device interfaces to the MAC layer through Reduced GMII (RGMII) and SGMII. In 100M mode, the device lets the designer use MII for lower Latency. Programmable integrated termination impedance on RGMII/MII helps reduce system BOM.