CSD25501F3

Texas Instruments
595-CSD25501F3
CSD25501F3

Mfr.:

Description:
MOSFETs -20-V P channel Nex FET power MOSFET s A A 595-CSD25501F3T

ECAD Model:
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In Stock: 335

Stock:
335
Can Dispatch Immediately
On Order:
15.000
Expected 3/27/2026
Factory Lead Time:
6
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
0,327 € 0,33 €
0,201 € 2,01 €
0,121 € 12,10 €
0,095 € 47,50 €
0,083 € 83,00 €
Full Reel (Order in multiples of 3000)
0,073 € 219,00 €
0,063 € 378,00 €
0,052 € 468,00 €
0,051 € 1.224,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Alternative Packaging

Mfr. Part No.:
Packaging:
Reel, Cut Tape, MouseReel
Availability:
In Stock
Price:
1,20 €
Min:
1

Similar Product

Texas Instruments CSD25501F3T
Texas Instruments
MOSFETs #NAME?

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: MOSFETs
RoHS:  
Si
SMD/SMT
PICOSTAR-3
P-Channel
1 Channel
20 V
3.6 A
260 mOhms
- 20 V, 20 V
1.05 V
1.02 nC
- 55 C
+ 150 C
500 mW
Enhancement
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Configuration: Single
Fall Time: 945 ns
Forward Transconductance - Min: 3.4 S
Product Type: MOSFETs
Rise Time: 428 ns
Series: CSD25501F3
Factory Pack Quantity: 3000
Subcategory: Transistors
Transistor Type: 1 P-Channel
Typical Turn-Off Delay Time: 1154 ns
Typical Turn-On Delay Time: 474 ns
Unit Weight: 0,300 mg
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TARIC:
8541290000
CNHTS:
8541210000
CAHTS:
8541290000
USHTS:
8541210095
JPHTS:
8541290100
KRHTS:
8541299000
MXHTS:
85412999
ECCN:
EAR99

CSD25501F3 –20V 64mΩ, P-Channel FemtoFET™ MOSFET

Texas Instruments CSD25501F3 –20V 64mΩ, P-Channel FemtoFET™ MOSFET is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing a substantial reduction in footprint size. The integrated 10kΩ clamp resistor (RC) allows the gate voltage (VGS) to be operated above the maximum internal gate oxide value of –6V, depending on the duty cycle. The gate leakage (IGSS) through the diode of the Texas Instruments CSD25501F3 increases as VGS is increased above –6V.