EDM1CFIMX6Q10START

TechNexion
570-EDM1CF-IMX6Q-ST
EDM1CFIMX6Q10START

Mfr.:

Description:
Development Boards & Kits - ARM The factory is currently not accepting orders for this product.

Lifecycle:
Factory Special Order:
Obtain a quote to verify the current price, lead-time and ordering requirements of the manufacturer.
Mouser does not presently sell this product in your region.

Availability

Stock:

Product Attribute Attribute Value Select Attribute
TechNexion
Product Category: Development Boards & Kits - ARM
Delivery Restrictions:
 Mouser does not presently sell this product in your region.
RoHS:  
Starter Kits
ARM Cortex A9
Brand: TechNexion
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Description/Function: EDM compact type 1 Freescale i.MX6 quad 1Ghz + 2GB RAM + 4GB iNAND + Gigabit LAN + 2 CAN + SATA & EDM Compact passive heatsink
Dimensions: 82 mm x 60 mm
For Use With: EDM1-CF-iMX6
Interface Type: CAN, GPIO, I2C, JTAG, MIPI, SPI, UART, USB
Maximum Operating Temperature: + 60 C
Minimum Operating Temperature: 0 C
Operating Supply Voltage: 5 V
Product Type: Development Boards & Kits - ARM
Factory Pack Quantity: 1
Subcategory: Development Tools
Unit Weight: 295,475 g
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

                        
The factory is currently not accepting orders for this product.

TARIC:
8471500000
CNHTS:
8473309000
USHTS:
8471500150
ECCN:
5A002.a.1

EDM1-CF-iMX6 EDM Compact Modules

TechNexion EDM1-CF-iMX6 EDM Compact Modules feature the Arm Cortex®-A9 NXP i.MX6 scalable single, dual, or quad core processor. These EDM type 1 compact System-on-Modules offer communication by gigabit LAN, Wi-Fi® 802.11 b/g/n, and Bluetooth v4.0. They are designed for multimedia applications with LVDS, TTL, HDMI, S/P DIF, I2S, MIPI camera, and display. Also available is the EDM1-Fairy Carrier Board for EDM Type 1 Compact Modules, featuring a variety of sensors and interconnects for quick development of mobile embedded devices. The carrier board offers HDMI, TTL, and LVDS display interfaces, and communication by dual PCI Express (with SIM card slots). It also provides Dual CAN Bus, Dual UART, USB, and 8 GPIOs for industrial control.