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2485264-1

Name: TE Connectivity 2485264-1
Brand: TE Connectivity
SKU: 571-2485264-1
Price: 0.78 EUR
Availability: InStock

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Mouser No:

571-2485264-1

Mfr. No:

2485264-1

Mfr.:

TE Connectivity

Description:

IC & Component Sockets DIP IC SOCKET 8P,GOLD FLASH

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2485264-1 Datasheet

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More Information

Learn more about TE Connectivity 2485264-1

In Stock: 3.923

Stock:: 3.923 Can Dispatch Immediately

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Factory Lead Time:: 9 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	0,783 €	0,78 €
	0,676 €	6,76 €
	0,631 €	15,78 €
	0,601 €	67,31 €
	0,562 €	157,36 €
	0,534 €	269,14 €
	0,469 €	2.363,76 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Sockets
Number of Positions:	8 Position
Number of Rows:	2 Row
Type:	DIP Socket
Pitch:	2.54 mm
Termination Style:	Through Hole
Contact Plating:	Gold
Row Spacing:	7.62 mm
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tube
Brand:	TE Connectivity
Contact Material:	Copper
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	1 A
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic (TP)
Mounting Style:	PCB Mount
Product Type:	IC & Component Sockets
Factory Pack Quantity:	56
Subcategory:	IC & Component Sockets

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Datasheet

2485264-1 Datasheet

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TARIC:: 8536693000
CNHTS:: 8536909000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.