2369022-4

TE Connectivity
571-2369022-4
2369022-4

Mfr.:

Description:
Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical

ECAD Model:
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In Stock: 448

Stock:
448 Can Dispatch Immediately
Factory Lead Time:
36 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 448 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
44,24 € 44,24 €
41,68 € 416,80 €
40,79 € 1.019,75 €
40,08 € 2.004,00 €
39,40 € 3.940,00 €
32,83 € 8.207,50 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
60 Position
1.27 mm (0.05 in)
6 Row
Solder Balls
Vertical
12 mm
1.5 A
- 55 C
+ 125 C
Gold
Copper
Liquid Crystal Polymer (LCP)
Brand: TE Connectivity
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 450
Subcategory: Board to Board & Mezzanine Connectors
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Attributes selected: 0

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CAHTS:
8533400000
USHTS:
8533408050
ECCN:
EAR99

Mezalok High-Speed Low-Force XMC Connectors

TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilise a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface-mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and is available in various positions and stack heights.