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2355825-3

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See Product Specifications

Mouser No:

571-2355825-3

Mfr. No:

2355825-3

Mfr.:

TE Connectivity

Description:

Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical

Lifecycle:

Factory Special Order:

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Datasheet:

2355825-3 Datasheet

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Receptacles
Number of Positions:	114 Position
Pitch:	1.27 mm (0.05 in)
Number of Rows:	6 Row
Termination Style:	Solder Balls
Mounting Angle:	Vertical
Stack Height:	12 mm
Current Rating:	1.5 A
Voltage Rating:	250 VAC
Maximum Data Rate:	32 Gbps
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper
Housing Material:	Liquid Crystal Polymer (LCP)
Packaging:	Reel
Brand:	TE Connectivity
Data Rate:	32 Gbps
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	350
Subcategory:	Board to Board & Mezzanine Connectors

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Datasheet

2355825-3 Datasheet

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Compliance Codes

CAHTS:: 8533400000
USHTS:: 8533408050
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Mezalok High-Speed Low-Force XMC Connectors

TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilise a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface-mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and is available in various positions and stack heights.