2355825-2

TE Connectivity
571-2355825-2
2355825-2

Mfr.:

Description:
Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical

Lifecycle:
Factory Special Order:
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Datasheet:
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Learn more about TE Connectivity 2355825-2

In Stock: 442

Stock:
442 Can Dispatch Immediately
Factory Lead Time:
36 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 442 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
61,71 € 61,71 €
54,89 € 548,90 €
49,93 € 1.248,25 €
46,57 € 2.328,50 €
45,40 € 4.540,00 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
114 Position
1.27 mm (0.05 in)
6 Row
Solder Balls
Vertical
10 mm
1.5 A
250 VAC
32 Gbps
- 55 C
+ 125 C
Gold
Copper
Liquid Crystal Polymer (LCP)
Brand: TE Connectivity
Data Rate: 32 Gbps
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 450
Subcategory: Board to Board & Mezzanine Connectors
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Attributes selected: 0

Datasheet

PCN

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CNHTS:
8536901100
CAHTS:
8533400000
USHTS:
8533408050
ECCN:
EAR99

Mezalok High-Speed Low-Force XMC Connectors

TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilise a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface-mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and is available in various positions and stack heights.

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