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2332798-6

Name: TE Connectivity 2332798-6
Brand: TE Connectivity
SKU: 571-2332798-6
Price: 53.15 EUR
Availability: OutOfStock

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Mouser No:

571-2332798-6

Mfr. No:

2332798-6

Mfr.:

TE Connectivity

Description:

Power to the Board CONNKIT,PWRSGNL,PANEL,12AWG

Datasheet:

2332798-6 Datasheet

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Availability

Stock:: 0

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On Order:: 60
Factory Lead Time:: 23

Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	53,15 €	53,15 €
	46,20 €	462,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Power to the Board
Product Type:	Power to the Board
Current Rating:	20 A
Voltage Rating:	300 VAC, 300 VDC
Number of Positions:	2 Power, 8 Signal
Mounting Style:	Panel Mount
Termination Style:	Crimp
Pitch:	2.54 mm
Brand:	TE Connectivity
Contact Material:	Copper Alloy
Contact Plating:	Nickel
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Housing Colour:	Orange
Housing Material:	Thermoplastic (TP)
Maximum Operating Temperature:	+ 150 C
Minimum Operating Temperature:	- 20 C
Mounting Angle:	Straight
Product:	Connector Kits
Subcategory:	Power Connectors
Wire Gauge Max:	12 AWG

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Datasheet

2332798-6 Datasheet

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TARIC:: 8536699099
USHTS:: 8536694030
ECCN:: EAR99

Unmanned Power (UMP) Connector Kits

TE Connectivity's (TE) Unmanned Power (UMP) Connector Kits provide a reliable contact interface that safely delivers power or power/signals to various parts of unmanned vehicles. These connectors offer up to 80A per contact and are available as power or mixed signal/power connectors. The UMP connectors are provided with the mating pair of connectors (both plug and receptacles). The connector kits are manufactured with stronger materials that have been proven in harsh environments and reliable contact interfaces, while taking into account weight and density. These connector kits can be sealed in wire-to-wire format for added environmental protection. The TE UMP connector kits can be used in high power in small form factor requirements. Typical applications include unmanned vehicles, ground defence, robotics and factory automation.