2331929-6

TE Connectivity
571-2331929-6
2331929-6

Mfr.:

Description:
Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 012 SMT G3 TBK

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
Non-Stocked
Factory Lead Time:
18 Weeks Estimated factory production time.
Minimum: 1680   Multiples: 1680
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
2,33 € 3.914,40 €
2,17 € 7.291,20 €
2,09 € 10.533,60 €

Similar Product

TE Connectivity 1MM-HU-D06-VS-00-H-TBP
TE Connectivity
Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 012 SMT G3 TBK

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Headers
12 Position
1 mm (0.039 in)
2 Row
Solder
Vertical
1 A
30 VAC
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
Tube
Application: Signal
Brand: TE Connectivity
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Flammability Rating: UL 94 V-0
Insulation Resistance: 1 GOhms
Mounting Style: PCB Mount
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 80
Subcategory: Board to Board & Mezzanine Connectors
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

USHTS:
8536694040
ECCN:
EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.