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2007637-6

Name: TE Connectivity 2007637-6
Brand: TE Connectivity
SKU: 571-2007637-6
Price: 35.16 EUR
Availability: InStock

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Mouser No:

571-2007637-6

Mfr. No:

2007637-6

Mfr.:

TE Connectivity

Description:

I/O Connectors SFP+assy 2x2 Spring Fingers Inner LP Sn

Datasheet:

2007637-6 Datasheet

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In Stock: 64

Stock:: 64 Can Dispatch Immediately

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Factory Lead Time:: 6 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 64 will be subject to minimum order requirements.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	35,16 €	35,16 €
	30,56 €	305,60 €
	29,23 €	584,60 €
	28,29 €	1.697,40 €
	24,28 €	2.428,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	I/O Connectors
RoHS:
Product:	Cage Assemblies
Number of Positions:	80 Position
Pitch:	0.8 mm
Contact Plating:	Gold
Mounting Style:	Through Hole
Termination Style:	Press Fit
Mounting Angle:	Right Angle
Series:	SFP+
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Brand:	TE Connectivity
Product Type:	I/O Connectors
Factory Pack Quantity:	20
Subcategory:	I/O Connectors
Unit Weight:	59,363 g

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Datasheet

2007637-6 Datasheet

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RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.