2007180-1

TE Connectivity
571-2007180-1
2007180-1

Mfr.:

Description:
I/O Connectors Cage 1x2 EMI Shield w/ lightpipes

ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
108
Expected 4/21/2026
Factory Lead Time:
10
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
20,76 € 20,76 €
17,65 € 176,50 €
16,33 € 489,90 €
14,81 € 888,60 €
14,80 € 1.776,00 €
14,53 € 3.923,10 €
14,03 € 7.155,30 €
1.020 Quote

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: I/O Connectors
RoHS:  
Cage Assemblies
Through Hole
Press Fit
Right Angle
SFP+
- 55 C
+ 105 C
Bulk
Accessory Type: Cage Assembly, 1x2 Ganged
Brand: TE Connectivity
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Housing Material: Nickel Silver
Number of Ports: 2 Port
Product Type: I/O Connectors
Factory Pack Quantity: 30
Subcategory: I/O Connectors
Type: SFP
Unit Weight: 100 g
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Attributes selected: 0

TARIC:
8517700000
CNHTS:
8538900000
CAHTS:
8538909090
USHTS:
8538908180
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.