2-2331929-5

TE Connectivity
571-2-2331929-5
2-2331929-5

Mfr.:

Description:
Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 050 SMT G3 TBK

Datasheet:
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Learn more about TE Connectivity 2-2331929-5

Availability

Stock:
Non-Stocked
Factory Lead Time:
6 Weeks Estimated factory production time.
Minimum: 441   Multiples: 441
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
7,15 € 3.153,15 €
6,68 € 5.891,76 €
6,13 € 8.109,99 €

Similar Product

TE Connectivity 1MM-HU-D25-VS-00-H-TBP
TE Connectivity
Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 050 SMT G3 TBK
Compare With Current Part

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Headers
50 Position
1 mm (0.039 in)
2 Row
Solder
Vertical
1 A
30 VAC
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
Tube
Application: Signal
Brand: TE Connectivity
Flammability Rating: UL 94 V-0
Insulation Resistance: 1 GOhms
Mounting Style: PCB Mount
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 21
Subcategory: Board to Board & Mezzanine Connectors
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Attributes selected: 0

Datasheet

Models

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Compliance Codes
USHTS:
8536694040
ECCN:
EAR99
Origin Classifications
Country of Origin:
Not available
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

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