1MM-R-D15-VS-00-F-TBP

TE Connectivity
571-1MMRD15VS00FTBP
1MM-R-D15-VS-00-F-TBP

Mfr.:

Description:
Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 030 SMT G1 TBK

Lifecycle:
Factory Special Order:
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Datasheet:
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More Information
Learn more about TE Connectivity 1MM-R-D15-VS-00-F-TBP

In Stock: 954

Stock:
954 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 954 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
4,70 € 4,70 €
4,58 € 45,80 €
4,47 € 111,75 €
4,30 € 146,20 €
4,13 € 421,26 €
3,43 € 1.749,30 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
30 Position
1 mm (0.039 in)
2 Row
Solder
Vertical
1 A
30 VAC
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
Tube
Brand: TE Connectivity
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Flammability Rating: UL 94 V-0
Insulation Resistance: 500 MOhms, 1 GOhms
Mounting Style: SMD/SMT
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 34
Subcategory: Board to Board & Mezzanine Connectors
Part # Aliases: 1-2267465-5
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Attributes selected: 0

Datasheet

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TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

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