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1MM-R-D08-VS-00-H-TBP

Name: TE Connectivity 1MM-R-D08-VS-00-H-TBP
Brand: TE Connectivity
SKU: 571-1MMRD08VS00HTBP
Price: 3.83 EUR
Availability: InStock

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Mouser No:

571-1MMRD08VS00HTBP

Mfr. No:

1MM-R-D08-VS-00-H-TBP

Mfr.:

TE Connectivity

Description:

Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 016 SMT G3 TBK

Datasheet:

1MM-R-D08-VS-00-H-TBP Datasheet

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Learn more about TE Connectivity 1MM-R-D08-VS-00-H-TBP

In Stock: 844

Stock:: 844 Can Dispatch Immediately

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Factory Lead Time:: 9 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 844 will be subject to minimum order requirements.

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Ext. Price:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	3,83 €	3,83 €
	2,86 €	143,00 €
	2,72 €	272,00 €
	2,67 €	651,48 €
	2,43 €	1.334,07 €
	2,34 €	2.141,10 €
	2,32 €	6.368,40 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Receptacles
Number of Positions:	16 Position
Pitch:	1 mm (0.039 in)
Number of Rows:	2 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Current Rating:	1 A
Voltage Rating:	30 VAC
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Liquid Crystal Polymer (LCP)
Packaging:	Tube
Brand:	TE Connectivity
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Flammability Rating:	UL 94 V-0
Insulation Resistance:	500 MOhms, 1 GOhms
Mounting Style:	SMD/SMT
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	61
Subcategory:	Board to Board & Mezzanine Connectors
Part # Aliases:	2267440-8

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Datasheet

1MM-R-D08-VS-00-H-TBP Datasheet

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TARIC:: 8536693000
CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.