1MM-HU-D08-VS-00-F-TBP

TE Connectivity
571-1MMHUD08VS00FTBP
1MM-HU-D08-VS-00-F-TBP

Mfr.:

Description:
Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 016 SMT G1 TBK

ECAD Model:
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In Stock: 1.197

Stock:
1.197 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 1197 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
2,72 € 2,72 €
2,63 € 65,75 €
1,87 € 112,20 €
1,57 € 188,40 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Headers
16 Position
1 mm (0.039 in)
2 Row
Solder
Vertical
4.3 mm
1 A
30 VAC
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
Tube
Brand: TE Connectivity
Flammability Rating: UL 94 V-0
Insulation Resistance: 500 MOhms, 1 GOhms
Mounting Style: PCB
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 60
Subcategory: Board to Board & Mezzanine Connectors
Part # Aliases: 2331928-8
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TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.