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1-1871673-6

Name: TE Connectivity 1-1871673-6
Brand: TE Connectivity
SKU: 571-1-1871673-6
Price: 3.34 EUR
Availability: OutOfStock

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Mouser No:

571-1-1871673-6

Mfr. No:

1-1871673-6

Mfr.:

TE Connectivity

Description:

Headers & Wire Housings DYNAMIC 1200D HDR ASSY H 12P BLACK TIN

Datasheet:

1-1871673-6 Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 13 Weeks Estimated factory production time.

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Est. Tariff:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	3,34 €	3.473,60 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Headers & Wire Housings
Series:	D-1000
Tradename:	DYNAMIC SERIES
Brand:	TE Connectivity
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	26
Subcategory:	Headers & Wire Housings

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Datasheet

1-1871673-6 Datasheet (PDF)

RoHS Certificate (PDF)

Compliance Codes

TARIC:: 8536909599
CAHTS:: 8536900020
USHTS:: 8536904000
JPHTS:: 8536900002
BRHTS:: 85369090
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Dynamic Series Ruggedized Connectors

TE Connectivity's (TE) Dynamic Series Ruggedized Connectors are designed for use in control systems and in a wide range of applications requiring high-density, signal, and power. The series features a ruggedized, industrialized package that provides connector solutions ranging from signal-level circuitry to power circuit connectivity. The portfolio includes wire-to-board, wire-to-panel, and wire-to-wire connectors with a diverse range of housings. Standard crimp and spring clamp variations of parts are available. The standardized contacts limit the amount of application tooling required. A centralized wiring system saves time and costs by offering a modular capability that allows for expansion as needed. Typical applications for TE Dynamic Series Ruggedized Connectors include industrial control, Human Machine Interface (HMI), data communication, robotics, power distribution, and more.