2349201-5

TE Connectivity / AMP
571-2349201-5
2349201-5

Mfr.:

Description:
I/O Connectors SFP56 STACKED 2X12 RECEPTACLE ASSEMBLY

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 9

Stock:
9 Can Dispatch Immediately
Factory Lead Time:
11 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 9 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
163,70 € 163,70 €
154,85 € 1.858,20 €
501 Quote

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: I/O Connectors
RoHS:  
Cage Assemblies
Female
20 Position
0.6 mm
Through Hole
Press Fit
Right Angle
- 55 C
+ 105 C
Brand: TE Connectivity / AMP
Color: Black
Contact Material: Copper Alloy
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Data Rate: 56 Gb/s
Flammability Rating: UL 94 V-0
Housing Material: Liquid Crystal Polymer (LCP)
Number of Ports: 24 Port
Product Type: I/O Connectors
Factory Pack Quantity: 3
Subcategory: I/O Connectors
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

zSFP+ Stacked I/O Interconnects

TE Connectivity's zSFP+ Stacked I/O Interconnects are fast single-channel I/O connectors that transfer data at 28Gbps NRZ and 56Gbps PAM-4. These pluggable interconnects are both backward-compatible to SFP/SFP+ products and hot-swappable with existing SFP+ connectors for fast system upgrades of 28Gbps to 56Gbps. Alternatively, users can design-in the zSFP+ connectors for 10Gbps to 16Gbps data rates, establishing a progressive path to higher speeds. This upgradeability can result in long-term cost savings and eliminates the need to fully redesign for higher performance.