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1-1775470-0

Name: TE Connectivity 1-1775470-0
Brand: TE Connectivity / AMP
SKU: 571-1-1775470-0
Price: 1.09 EUR
Availability: InStock

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Mouser No:

571-1-1775470-0

Mfr. No:

1-1775470-0

Mfr.:

TE Connectivity / AMP

Description:

Headers & Wire Housings 10 POS HDR VERT SMT 2.0mm

Datasheet:

1-1775470-0 Datasheet

ECAD Model:

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In Stock: 1.118

Stock:: 1.118 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	1,09 €	1,09 €
	0,937 €	9,37 €
	0,791 €	79,10 €
Full Reel (Order in multiples of 500)
	0,713 €	356,50 €
	0,589 €	589,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Shrouded
Number of Positions:	10 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	1 Row
Mounting Style:	SMD/SMT
Termination Style:	Solder
Mounting Angle:	Straight
Contact Gender:	Pin (Male)
Contact Plating:	Tin
Series:	HPI
Application:	Wire-to-Board
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Reel
Packaging:	Cut Tape
Brand:	TE Connectivity / AMP
Contact Material:	Brass
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	500
Subcategory:	Headers & Wire Housings

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Datasheet

1-1775470-0 Datasheet

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RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

HPI and CT Connectors

TE Connectivity / AMP High Performance Interconnects (HPI) polarized connectors feature reliable wire-to-board sockets and headers that provide audible click feedback when mating. The connectors are available in 2 to 15 positions and accommodate AWG 30 to 24 wire. TE Connectivity / AMP Common Termination (CT) Connectors feature mini 1.5mm and 2mm post header, receptacle, and crimp type housing assemblies for wire-to-board applications. The devices are available in 1 row and 2 row types and feature insulation displacement contacts (IDC).