MLF2012C820KT000

TDK
810-MLF2012C820KT000
MLF2012C820KT000

Mfr.:

Description:
RF Inductors - SMD 2mm x 1.25mm x 1.25mm, -40 to +85 degC, 2mA, 82 H, 3O

Datasheet:
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Learn more about TDK MLF2012C820KT000

In Stock: 7.748

Stock:
7.748 Can Dispatch Immediately
Factory Lead Time:
15 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,103 € 0,10 €
0,088 € 0,88 €
0,072 € 7,20 €
0,068 € 68,00 €
Full Reel (Order in multiples of 2000)
0,06 € 120,00 €
0,055 € 220,00 €
0,049 € 490,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
TDK
Product Category: RF Inductors - SMD
RoHS:  
Multilayer
0805 (2012 metric)
Shielded
82 uH
10 %
2 mA
3 Ohms
- 55 C
+ 125 C
25
14 MHz
Standard
2 mm
1.25 mm
1.25 mm
Ferrite
MLF
Reel
Cut Tape
MouseReel
Application: Commercial
Brand: TDK
Case Code - in: 0805
Case Code - mm: 2012
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 2000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Test Frequency: 1 MHz
Part # Aliases: MLF2012C820KT000 -
Unit Weight: 10 mg
Products found:
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Attributes selected: 0

Datasheet

Models

TARIC:
8504500090
CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
850450000
KRHTS:
8504502090
MXHTS:
8504509199
BRHTS:
85045000
ECCN:
EAR99

Inductors

TDK Inductors are manufactured using state-of-the-art multilayer processing technologies, wire-winding technology, or thin-film technologies. TDK's unique multilayer processing technology provides higher inductance and Q characteristics as well as further miniaturisation. The portfolio includes a wide spectrum of filters, SMT inductors, power inductors, transponder coils and line reactors. These components are designed for use in high-frequency, signal, and power circuits. TDK Inductors are ideal for a range of applications including mobile devices, consumer electronics, solar power inverters, power supplies, on-board chargers, and automobile systems.

Automotive Inductors

TDK Automotive Inductors are designed for a wide range of applications. These automotive applications include tire pressure monitoring systems, BLUETOOTH® connectivity systems, car navigation, power steering, in-vehicle electronic control units, advanced driver assistance systems, and more. AEC-Q200-qualified inductors are available.

Automotive Products

TDK, recognized as an industry leader in passive electronic components, offers many product series related to automotive applications. TDK’s wide array of products, including MLCCs, inductors, ferrite beads, and more, utilizes specialized materials and unique structural designs. These materials and designs offer high performance and reliability under the most severe usage conditions and in the harsh environments found in automotive applications.

Signal Inductors

TDK Signal Inductors are manufactured using state-of-the-art multilayer processing and wire-winding technologies. Its wire-winding technology uses a highly-effective closed magnetic circuit with ferrite particles of high permeability, to enable lower Rdc values and reduced energy consumption. TDK Signal Inductors are designed for use in a wide variety of applications, ranging from mobile devices and consumer electronics to various types of automotive equipment and systems.

MLF Fixed Inductors

 TDK MLF Fixed Inductors are developed to be smaller and thinner, but with more advanced functions. TDK MLF Fixed Inductors are magnetically shielded, making high-density mounting possible. These inductors do not contain lead and are compatible with lead-free soldering. MLF inductors offer a wide inductance range and highly reliable monolithic structure with multilayer integration.

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