HHM1523B3

TDK
810-HHM1523B3
HHM1523B3

Mfr.:

Description:
Signal Conditioning LTCC BALUN 824-894MHz

ECAD Model:
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In Stock: 2.405

Stock:
2.405 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
0,198 € 0,20 €
0,177 € 1,77 €
0,166 € 4,15 €
0,162 € 16,20 €
0,153 € 38,25 €
0,145 € 72,50 €
0,134 € 134,00 €
Full Reel (Order in multiples of 2000)
0,134 € 268,00 €
0,118 € 472,00 €
0,111 € 1.110,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
TDK
Product Category: Signal Conditioning
RoHS:  
Signal Conditioning
Baluns
855 MHz
70 MHz
50 Ohms, 100 Ohms
SMD/SMT
0805 (2012 metric)
- 40 C
+ 85 C
HHM
Reel
Cut Tape
MouseReel
Brand: TDK
Insertion Loss: 1.2 dB
Mounting: Board Mount
Factory Pack Quantity: 2000
Subcategory: Filters
Type: Balun Transformer
Part # Aliases: HHM1523B3 -
Unit Weight: 5,500 mg
Products found:
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Attributes selected: 0

TARIC:
8529909790
CNHTS:
8548000002
CAHTS:
8504500000
USHTS:
8504312000
JPHTS:
850431000
KRHTS:
8504509090
MXHTS:
8504509102
BRHTS:
85045000
ECCN:
EAR99

RF Components

TDK RF Components include a large selection of antennas, diplexers, triplexers, baluns, filters, and couplers designed for cellular phones, wireless LAN, and BLUETOOTH®. To meet the ever-increasing demand for compact, slim, lightweight, and high-performing components, TDK RF components make full use of material technologies such as ferrites and ceramics and thin-film technologies. TDK RF components provide leading-edge miniaturization technology while providing exceptional electrical characteristics and are recommended by leading WLAN chipset manufacturers for 2.4GHz and 5GHz WLAN.

RF Baluns

TDK RF Baluns offer an extensive range of SMD/SMT models with various impedances ranging from 50 to 200Ω. The passive baluns are available in 0603 (1608 metric), 0402 (1005 metric), and 0805 (2012 metric) case sizes, operating from -40°C to +85°C temperatures. TDK multilayer chip transformer baluns are useful in applications such as cellular phones, wireless LAN, and BLUETOOTH®. These baluns are constructed with low temperature co-fired ceramics (LTCC), converting signals from balanced to unbalanced, and vice versa. TDK RD Baluns provide leading edge miniaturization technology while providing exceptional electrical characteristics for 2.4GHz and 5GHz WLAN.

HHM Baluns

TDK HHM Baluns are designed to meet the growing demands for compact, slim, lightweight, and high-performing components. The HHM Series uses material technologies such as ferrites and ceramics in thin-film technology. TDK Baluns provide leading-edge miniaturization technology while providing exceptional electrical characteristics for 2.4GHz & 5GHz WLAN. Applications include telecommunication, wireless LAN, and BLUETOOTH®.

RF Couplers

TDK RF Couplers offer multiple types of directional couplers, including the HHM Series Multilayer Chip Directional Couplers for LTE/GSM/DCS/PCS and the TFS Series Couplers. The HHM29xxxx Series includes a variety of coupling characteristics and frequency ranges, including the HHM2909C4 that offers four frequency ranges from 777MHz to 1910MHz, coupling factor range from 12.8±1.0dB to 20.4±1.0dB, and operating temperature range from -40°C to +85°C.