FS1406-0750-AS

TDK
810-FS1406-0750-AS
FS1406-0750-AS

Mfr.:

Description:
DC/DC Converters - SMD 0.75V uPOL 6A Power Module

Datasheet:
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Learn more about TDK FS1406-0750-AS

In Stock: 200

Stock:
200 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 200 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
5,19 € 5,19 €
5,10 € 25,50 €
5,02 € 50,20 €
4,82 € 120,50 €
4,74 € 237,00 €
4,48 € 448,00 €
Full Reel (Order in multiples of 250)
3,81 € 952,50 €
3,80 € 1.900,00 €

Product Attribute Attribute Value Select Attribute
TDK
Product Category: DC/DC Converters - SMD
RoHS:  
Non-Isolated
1 Output
4.5 V
16 V
750 mV
6 A
SMD-17 Module
3.3 mm (0.13 in)
3.3 mm (0.13 in)
1.5 mm (0.059 in)
Industrial
FS1406
Brand: TDK
Case Style: Open Frame
Input Voltage: 4.5 V to 16 V
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Packaging: Reel
Packaging: Cut Tape
Product: Non-Isolated / PoL
Product Type: Non-Isolated DC-DC Converters
Factory Pack Quantity: 250
Subcategory: DC-DC Converters
Tradename: uPOL
Part # Aliases: FS1406-0750-AS -
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Attributes selected: 0

Compliance Codes
TARIC:
8504409590
USHTS:
8504409580
ECCN:
EAR99
Origin Classifications
Country of Origin:
Taiwan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

μPOL™ DC-DC Power Modules

TDK μPOL™ DC-DC Power Modules are compact and highly integrated point-of-load (POL) converters. These modules are ideal for powering CPUs, MCUs, ASICs, FPGAs, DSPs and other advanced digital logic devices. The µPOL high current density power modules provide the high performance, fast load transient response and high accuracy voltage regulation required by these devices. These Micro-POL converters feature a chip-embedded power IC in a thermally enhanced semiconductor-embedded-in-substrate package.

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