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S35ML04G300WHI003

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See Product Specifications

Mouser No:

727-S35ML04G3WHI003

Mfr. No:

S35ML04G300WHI003

Mfr.:

SkyHigh Memory

Description:

NAND Flash 0BIT ECC, X1 X2 X4 I/O AND 3V VCC SLC NAND FLASH MEMORY 2KB PAGE SIZE LGA

Datasheet:

S35ML04G300WHI003 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about SkyHigh Memory S35ML04G300WHI003

Availability

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	SkyHigh Memory
Product Category:	NAND Flash
Mounting Style:	SMD/SMT
Package/Case:	LGA-8
Memory Size:	4 Gbit
Interface Type:	SPI
Organisation:	512 M x 8
Timing Type:	Synchronous
Data Bus Width:	8 bit
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Supply Current - Max:	35 mA
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Reel
Active Read Current - Max:	35 mA
Brand:	SkyHigh Memory
Maximum Clock Frequency:	104 MHz
Product Type:	NAND Flash
Factory Pack Quantity:	2500
Subcategory:	Memory & Data Storage

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Datasheet

S35ML04G300WHI003 Datasheet (PDF)

Compliance Codes

CAHTS:: 8542320040
USHTS:: 8542320051
MXHTS:: 8542320299
ECCN:: 3A991.b.1.a

Origin Classifications

Country of Origin:: Korea, Republic of
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

S35MLxG3 SPI SLC NAND Flash Memory

SkyHigh Memory S35MLxG3 SPI SLC NAND Flash Memory devices offer a 3.3V V_CC power supply and industry-standard Serial Peripheral Interface (SPI). The NAND cell provides a cost-effective solution for the solid-state mass storage market with a low pin count and a modified SPI-NOR command. The memory is divided into blocks that can be erased independently that preserve valid data while old data is erased. The page size for the 1Gb/2Gb/4Gb SPI devices is (2048+128 spare) bytes and for the 1Gb device with 64 bytes spare option is (2048+64 spare) bytes. The S35MLxG3 memory devices are designed with a powerful internal ECC engine and 1 bit ECC is recommended to protect the system bus from transmission errors. The devices are available in the LGA-8 pins (6mm x 8 mm), SOIC-16 pins (300 mil), and FBGA-24 pins (8mm x 6 mm) packages.