MGM260PD32VNN2

Silicon Labs
634-MGM260PD32VNN2
MGM260PD32VNN2

Mfr.:

Description:
Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 23

Stock:
23
Can Dispatch Immediately
On Order:
100
Expected 3/27/2026
100
Expected 4/3/2026
Factory Lead Time:
23
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
10,07 € 10,07 €
8,75 € 87,50 €
8,60 € 430,00 €
7,30 € 730,00 €
7,21 € 1.442,00 €
7,02 € 3.510,00 €
6,77 € 6.770,00 €

Product Attribute Attribute Value Select Attribute
Silicon Labs
Product Category: Multiprotocol Modules
RoHS:  
MGM260P
2.4 GHz
20 dBm
ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART
1.8 V
3.8 V
- 40 C
+ 125 C
12.9 mm x 15 mm
Bluetooth, BLE
Thread, Zigbee - 802.15.4
Cut Tape
Antenna: PCB Trace
Brand: Silicon Labs
Core: 32-bit ARM Cortex M33
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Data Rate: 2 Mb/s
Memory Size: 3.2 MB Flash, 512 kB RAM
Modulation Technique: DSSS, GFSK, O-QPSK
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Operating Supply Voltage: 1.8 V to 3.8 V
Product: Multiprotocol Wireless Module
Product Type: Multiprotocol Modules
Protocol: Bluetooth v5.4
Sensitivity: - 105.6 dBm
Factory Pack Quantity: 100
Subcategory: Wireless & RF Modules
Supply Current Receiving: 6.4 mA
Supply Current Transmitting: 162 mA
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Attributes selected: 0

TARIC:
8517620000
USHTS:
8517620090
JPHTS:
851762090
ECCN:
5A992.C

xGM260P Wireless Modules

Silicon Labs xGM260P Wireless Modules are 2.4GHz frequency devices that deliver excellent RF performance. The MGM260P modules are based on the EFR32MG26 System-on-Chips (SoCs) and support Bluetooth®, Zigbee®, Thread, and Matter protocols. These MGM260P modules feature Secure Vault® technology and support various advanced debugging and development tools. The BGM260P modules are based on the EFR32BG26 SoCs and support Bluetooth Low Energy (BLE) and Bluetooth mesh. These xGM260P wireless modules are ideal for use in light bulbs and designs that require extra PCB layout flexibility.