BGM13P32F512GE-V2

Silicon Labs
634-BGM13P32F512GEV2
BGM13P32F512GE-V2

Mfr.:

Description:
Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector

ECAD Model:
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In Stock: 428

Stock:
428 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
10,61 € 10,61 €
9,07 € 90,70 €
8,74 € 437,00 €
8,08 € 808,00 €
7,61 € 1.522,00 €
7,40 € 3.700,00 €
6,99 € 6.990,00 €

Product Attribute Attribute Value Select Attribute
Silicon Labs
Product Category: Bluetooth Modules - 802.15.1
RoHS:  
BGM13P
BLE, Bluetooth 5.0
I2C, UART, USART
19 dBm
1 Mb/s
- 94.8 dBm
2.4 GHz
1.8 V
3.8 V
- 40 C
+ 85 C
Cut Tape
Antenna: U.FL
Brand: Silicon Labs
Core: ARM Cortex M4
Dimensions: 12.9 mm x 15 mm x 2.2 mm
Height: 2.2 mm
Length: 15 mm
Memory Size: 64 kB, 512 kB
Modulation: GFSK
Modulation Technique: GFSK
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Operating Supply Voltage: 1.8 V to 3.8 V
Product Type: Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1: Bluetooth LE
Factory Pack Quantity: 100
Subcategory: Wireless & RF Modules
Supply Current Receiving: 9.9 mA
Supply Current Transmitting: 9.5 mA
Tradename: Blue Gecko
Type: USB Adapter
Width: 12.9 mm
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Attributes selected: 0

TARIC:
8517620000
CNHTS:
8517799000
USHTS:
8517620090
JPHTS:
851762090
ECCN:
5A992.C

BGM13P Blue Gecko Bluetooth Mesh Modules

Silicon Labs BGM13P Blue Gecko BLUETOOTH® Mesh Modules offer a turnkey BLUETOOTH 5 system in a compact package. Based on the Silicon Labs EFR32BG13 Blue Gecko SoC (System on Chip), BGM13P Modules feature an Arm® Cortex-M4 core with 512kB Flash, 64kB RAM, and up to +8dBm output power. These fully-certified modules integrate all components required (BLUETOOTH Wireless SoC, RF Antenna, and BLUETOOTH 5 compliant BLUETOOTH stack) to provide a complete, pre-certified, plug-and-play solution. This integration accelerates time-to-market and saves months of engineering effort and development costs. In addition, common software and development tools enable seamless migration between modules, SIPs, and SoC-based designs.