503KT1608T-1P

Semitec
954-503KT1608T-1P
503KT1608T-1P

Mfr.:

Description:
NTC (Negative Temperature Coefficient) Thermistors 50kohm 1% 0603

Datasheet:
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Learn more about Semitec 503KT1608T-1P

In Stock: 7.883

Stock:
7.883 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,201 € 0,20 €
0,187 € 1,87 €
0,165 € 4,13 €
0,156 € 15,60 €
0,137 € 68,50 €
0,122 € 122,00 €
Full Reel (Order in multiples of 4000)
0,116 € 464,00 €
0,11 € 880,00 €
0,108 € 2.592,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Semitec
Product Category: NTC (Negative Temperature Coefficient) Thermistors
RoHS:  
KT
4055 K
50 kOhms
4.5 mW
1 %
PCB Mount
SMD/SMT
- 40 C
+ 125 C
0603 (1608 metric)
1.6 mm
0.8 mm
0.95 mm
Reel
Cut Tape
MouseReel
Brand: Semitec
Product Type: NTC Thermistors
Factory Pack Quantity: 4000
Subcategory: Thermistors
Type: NTC
Unit Weight: 15,556 mg
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Attributes selected: 0

Datasheet

Compliance Codes
TARIC:
8533401000
CNHTS:
8533400000
CAHTS:
8533400000
USHTS:
8533408070
JPHTS:
853340000
KRHTS:
8533409000
MXHTS:
8533409102
BRHTS:
85334011
ECCN:
EAR99
Origin Classifications
Country of Origin:
Philippines
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

KT Thermistors

Semitec USA KT Thermistors are specially processed, highly reliable, and capable of detecting temperature within relatively small time constants. These monolithic chip thermistors are available in EIA 0402 and 0603 case sizes. The KT series offers an approximate response time of 2.2s to 5s and operates in the temperature range of -40°C to +125°C. Semitec USA KT Thermistors can be face-bonded to act as thermal compensators for ICs.

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