QSE-014-01-H-D-DP-A-RT1

Samtec
200-QSE01401HDDPART1
QSE-014-01-H-D-DP-A-RT1

Mfr.:

Description:
Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 65   Multiples: 65
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
9,95 € 646,75 €
9,19 € 1.194,70 €

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Sockets
28 Position
0.8 mm (0.031 in)
2 Row
Solder
Straight
5 mm
2 A
225 VAC
- 55 C
+ 125 C
Gold
Phosphor Bronze
Liquid Crystal Polymer (LCP)
QSE
Tray
Application: Power, Signal
Brand: Samtec
Flammability Rating: UL 94 V-0
Mounting Style: SMD/SMT
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 65
Subcategory: Board to Board & Mezzanine Connectors
Tradename: Q Strip
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Attributes selected: 0

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Q Strip™ High-Speed Mezzanine Connectors

Samtec Q Strip™ High-Speed Mezzanine Connectors are designed for high-speed board-to-board applications where signal integrity is essential. Q Strip connectors have surface-mount signal contacts and a surface-mount ground plane between the two rows of signals for improved electrical performance. Mated sets of Samtec Q Strip connectors are available in 8 different stack heights from 5mm (.197") to 30mm (1.180"). Options include guideposts for blind mate scenarios and alignment pins and locking clips for proper connector placement before reflow.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

Q Strip™ QSE High-Speed Ground Plane Socket Strips

Samtec Q Strip™ QSE High-Speed Ground Plane Socket Strips are available in up to 200 positions with 5mm to 30mm stack heights and 0.80mm pitch. These high-speed sockets feature an integral metal plane for power or ground use, allowing contacts to be placed closer together without hindering signal performance. Samtec Q Strip QSE Socket Strips utilize a blade-and-beam contact system that accommodates the micro pitch and assists with mating and alignment. The QSE-EM series is a Q Strip High-Speed Ground Plane Socket Strip with an edge-mount design. These socket strips feature up to 160 positions and 0.80mm pitch. 

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.