HDTM-3-06-2-S-VT-5-R-3

Samtec
200-HDTM3062SVT5R3
HDTM-3-06-2-S-VT-5-R-3

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
9,12 € 9,12 €
8,22 € 82,20 €
7,33 € 183,25 €
5,98 € 574,08 €
5,53 € 1.592,64 €

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Tray
Brand: Samtec
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 48
Subcategory: Backplane Connectors
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Attributes selected: 0

USHTS:
8536694040

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.