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HDTF-3-06-S-RA-HS-100

Name: Samtec HDTF-3-06-S-RA-HS-100
Brand: Samtec
SKU: 200-HDTF-306SRAHS100
Price: 13.37 EUR
Availability: OutOfStock

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Mouser No:

200-HDTF-306SRAHS100

Mfr. No:

HDTF-3-06-S-RA-HS-100

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle

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Learn more about Samtec HDTF-3-06-S-RA-HS-100

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 6 Weeks Estimated factory production time.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	13,37 €	13,37 €
	12,06 €	120,60 €
	10,74 €	268,50 €
	8,77 €	736,68 €
	8,10 €	4.082,40 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Receptacles
Number of Rows:	6 Row
Pitch:	1.8 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	HDTF
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	42
Subcategory:	Backplane Connectors
Tradename:	XCede

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Models

HDTF-3-06-S-RA-HS-100 Symbol & Footprint by SnapMagic

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD HDTF Right-Angle Backplane Receptacles

Samtec XCede® HD HDTF Right-Angle 1.8mm Backplane Receptacles feature a 1.8mm column pitch, 84 differential pairs per inch, and a modular design for application flexibility. These Samtec receptacles are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. The HDTF backplane receptacles are built with liquid crystal polymer (LCP) housing and copper alloy contact material. These receptacles are RoHS compliant and operate at -40°C to +105°C temperature range. XCede HD HDTF backplane receptacles mate with the XCede HD HDTM vertical backplane headers.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.