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EBCF-3-4-06-V-1-12-V-1

Name: Samtec EBCF-3-4-06-V-1-12-V-1
Brand: Samtec
SKU: 200-EBCF3406V112V1
Price: 343.97 EUR
Availability: InStock

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Mouser No:

200-EBCF3406V112V1

Mfr. No:

EBCF-3-4-06-V-1-12-V-1

Mfr.:

Samtec

Description:

Rectangular Cable Assemblies EXAMAX BACKPLANE CABLE, 34AWG TwinAx 100OHM, 12in

Lifecycle:

New At Mouser

Datasheet:

EBCF-3-4-06-V-1-12-V-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec EBCF-3-4-06-V-1-12-V-1

In Stock: 2

Stock:: 2 Can Dispatch Immediately

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Factory Lead Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

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Est. Tariff:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	343,97 €	343,97 €
5	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Rectangular Cable Assemblies
RoHS:
Series:	EBCF
Packaging:	Bulk
Brand:	Samtec
Product Type:	Rectangular Cable Assemblies
Factory Pack Quantity:	1
Subcategory:	Cable Assemblies
Tradename:	ExaMAX

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Datasheet

EBCF-3-4-06-V-1-12-V-1 Datasheet (PDF)

Product Catalogs

EBCF Series Catalog (PDF)

TARIC:: 8544421000
USHTS:: 8544422000
JPHTS:: 854442010
BRHTS:: 85444200
ECCN:: EAR99

EBCF ExaMAX 2mm High-Speed Backplane Cable Sockets

Samtec EBCF ExaMAX® 2mm High-Speed Backplane Cable Sockets offer a 2.00mm pitch and mate with Samtec EBCM, EBTM, and EBCL products. These cable sockets feature improved signal integrity, increased flexibility and routability, and have 4-pair and 6-pair options available. Multiple end options are provided, including vertical latch and right angle. Samtec EBCF ExaMAX 2mm High-Speed Backplane Cable Sockets provide a 4.2A current rating per pin and an operating temperature range of -55°C to +105°C.

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.