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ASP-222919-01

Name: Samtec ASP-222919-01
Brand: Samtec
SKU: 200-ASP-222919-01
Price: 3.47 EUR
Availability: InStock

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Mouser No:

200-ASP-222919-01

Mfr. No:

ASP-222919-01

Mfr.:

Samtec

Description:

Board to Board & Mezzanine Connectors MOD. JSOM ASSY 10MM STACK - COM HPC

Lifecycle:

Factory Special Order:

Obtain a quote to verify the current price, lead-time and ordering requirements of the manufacturer.

Datasheet:

ASP-222919-01 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec ASP-222919-01

In Stock: 980

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	3,47 €	3,47 €
	2,89 €	28,90 €
	2,76 €	276,00 €
	2,59 €	647,50 €
	2,48 €	1.240,00 €
1.000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Accessories
Stack Height:	10 mm
Accessory Type:	Standoff
Brand:	Samtec
Product Type:	Board to Board & Mezzanine Connectors
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	COM-HPC

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Attributes selected: 0

Filter Document:

CAHTS:: 7318190000
USHTS:: 7318190000
KRHTS:: 7318190000
BRHTS:: 73181900
ECCN:: EAR99

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

COM-HPC™ Interconnect Solutions

Samtec COM-HPC™ Interconnect Solutions offer up to 300W power rating, 400 total pins, and up to 32Gbps per channel. COM-HPC solutions provide ultra-high-speed performance and extended connectivity with limitless scalability, ensuring to meet the growing demands. These high-density interconnecting systems meet the COM-HPC standard for high-performance Computer-on-Modules. Samtec COM-HPC Interconnect Solutions are ideal for medical imaging, embedded edge servers, 5G connected vehicles, 5G wireless infrastructure, and industrial applications.