SCT4036KEHRC11

ROHM Semiconductor
755-SCT4036KEHRC11
SCT4036KEHRC11

Mfr.:

Description:
SiC MOSFETs TO247 1.2KV 43A N-CH SIC

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In Stock: 115

Stock:
115 Can Dispatch Immediately
Factory Lead Time:
27 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 115 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
16,65 € 16,65 €
14,67 € 146,70 €
11,76 € 1.176,00 €
11,35 € 5.107,50 €
5.400 Quote

Product Attribute Attribute Value Select Attribute
ROHM Semiconductor
Product Category: SiC MOSFETs
RoHS:  
Through Hole
TO-247N-3
N-Channel
1 Channel
1.2 kV
43 A
47 mOhms
- 4 V, + 21 V
4.8 V
91 nC
+ 175 C
176 W
Enhancement
Brand: ROHM Semiconductor
Configuration: Single
Fall Time: 12 ns
Forward Transconductance - Min: 11 S
Packaging: Tube
Product: MOSFET's
Product Type: SiC MOSFETS
Rise Time: 28 ns
Factory Pack Quantity: 450
Subcategory: Transistors
Technology: SiC
Transistor Type: 1 N-Channel
Typical Turn-Off Delay Time: 31 ns
Typical Turn-On Delay Time: 10 ns
Part # Aliases: SCT4036KEHR
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TARIC:
8541290000
CNHTS:
8541290000
USHTS:
8541290065
ECCN:
EAR99

AEC-Q101 SiC Power MOSFETs

ROHM Semiconductor AEC-Q101 SiC Power MOSFETs are ideal for automotive and switch-mode power supplies. The SiC Power MOSFETs can boost switching frequency, decreasing the volumes of capacitors, reactors, and other components required. AEC-Q101 SiC Power MOSFETs offer excellent reductions in size and weight within various drive systems, such as inverters and DC-DC converters in vehicles. Vehicle batteries are trending towards larger capacities with shorter charging times. This demands high power and efficiency on board chargers such as 11kW and 22kW. This leads to increased adoption of SiC MOSFETs. The AEC-Q101 SiC Power MOSFETs meet the needs of electronic vehicles and utilize a trench gate structure. The future design of ROHM's SiC MOSFETs endeavors to improve quality, strengthen its lineup to increase device performance, reduce power consumption, and achieve greater miniaturization.