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MIMX8UD3DVP08SC

Name: NXP MIMX8UD3DVP08SC
Brand: NXP Semiconductors
SKU: 771-MIMX8UD3DVP08SC
Price: 16.5 EUR
Availability: OutOfStock

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Mouser No:

771-MIMX8UD3DVP08SC

Mfr. No:

MIMX8UD3DVP08SC

Mfr.:

NXP Semiconductors

Description:

RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications

Datasheet:

MIMX8UD3DVP08SC Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 16 Weeks Estimated factory production time.

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Minimum: 630 Multiples: 630

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	16,50 €	10.395,00 €
1.260	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	NXP
Product Category:	RF System on a Chip - SoC
RoHS:
Type:	SOC
Core:	ARM Cortex A35
Operating Frequency:	800 MHz
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	NXP Semiconductors
Mounting Style:	SMD/SMT
Product Type:	RF System on a Chip - SoC
Series:	i.MX 8ULP
Factory Pack Quantity:	630
Subcategory:	Wireless & RF Integrated Circuits
Technology:	Si
Part # Aliases:	935447978557

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Datasheet

MIMX8UD3DVP08SC Datasheet (PDF)

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CNHTS:: 8542319090
USHTS:: 8542310070
ECCN:: 5A992.C

i.MX 8ULP Crossover Applications Processors

NXP Semiconductors i.MX 8ULP Crossover Applications Processors brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. EdgeLock secure enclave is pre-configured to simplify complex security implementations. The i.MX 8ULP devices feature NXP’s Energy Flex architecture that combines heterogeneous domain computing, design techniques, and process technology. A dedicated power management subsystem offers more than twenty power mode combinations to deliver exceptional efficiency across various applications.