MIMX8UD3DVP08SC

NXP Semiconductors
771-MIMX8UD3DVP08SC
MIMX8UD3DVP08SC

Mfr.:

Description:
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
16 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
19,91 € 19,91 €
15,94 € 159,40 €
14,96 € 374,00 €
13,86 € 1.386,00 €
13,30 € 3.325,00 €
13,20 € 6.600,00 €
1.000 Quote

Product Attribute Attribute Value Select Attribute
NXP
Product Category: RF System on a Chip - SoC
RoHS:  
SOC
ARM Cortex A35
800 MHz
- 40 C
+ 85 C
Tray
Brand: NXP Semiconductors
Mounting Style: SMD/SMT
Product Type: RF System on a Chip - SoC
Series: i.MX 8ULP
Factory Pack Quantity: 630
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
Part # Aliases: 935447978557
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Compliance Codes
CNHTS:
8542319090
USHTS:
8542310070
ECCN:
5A992.C
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
China
Country of Diffusion:
Korea, Republic of
The country is subject to change at the time of shipment.

i.MX 8ULP Crossover Applications Processors

NXP Semiconductors i.MX 8ULP Crossover Applications Processors brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. EdgeLock secure enclave is pre-configured to simplify complex security implementations. The i.MX 8ULP devices feature NXP’s Energy Flex architecture that combines heterogeneous domain computing, design techniques, and process technology. A dedicated power management subsystem offers more than twenty power mode combinations to deliver exceptional efficiency across various applications.