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MF1P4230DA4/00J

Name: NXP MF1P4230DA4/00J
Brand: NXP Semiconductors
SKU: 771-MF1P4230DA4/00J
Price: 0.89 EUR
Availability: OutOfStock

Mouser No:

771-MF1P4230DA4/00J

Mfr. No:

MF1P4230DA4/00J

Mfr.:

NXP Semiconductors

Description:

Security ICs / Authentication ICs MF1P4230DA4/00

Datasheet:

MF1P4230DA4/00J Datasheet (PDF)

ECAD Model:

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More Information

Learn more about NXP Semiconductors MF1P4230DA4/00J

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 16 Weeks Estimated factory production time.

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Minimum: 17500 Multiples: 17500

Unit Price:

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Ext. Price:

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Est. Tariff:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 17500)
	0,894 €	15.645,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	NXP
Product Category:	Security ICs / Authentication ICs
RoHS:
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Mounting Style:	SMD/SMT
Package/Case:	MOA-4
Packaging:	Reel
Brand:	NXP Semiconductors
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TH
Data Rate:	848 kb/s
Memory Type:	EEPROM
Product Type:	Security ICs / Authentication ICs
Series:	MFPEV2
Factory Pack Quantity:	17500
Subcategory:	Security ICs / Authentication ICs
Tradename:	MIFARE PLUS
Part # Aliases:	935404438118

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Datasheet

MF1P4230DA4/00J Datasheet (PDF)

USHTS:: 8542310030
ECCN:: 5A992.C

RF-IF Solutions

NXP Semiconductors RF-IF Solutions meet the needs of the most demanding RF applications by allowing designers to meet the highest specifications for performance while still retaining potential trade-offs with respect to efficiency, power, ruggedness, consistency, and integration levels. The NXP RF-IF portfolio covers the majority of communication and transmission systems, making it easy to find a solution that matches a designer's particular requirements. NXP RF-IF solutions include the SA6xx Series RF/IF building blocks that are ideal for a variety of niche handheld RF products. Available in small-footprint packages, SA6xx solutions save PCB space while providing better RF performance.