90160-0160

Molex
538-90160-0160
90160-0160

Mfr.:

Description:
Headers & Wire Housings C-Grid Crp Conn Hsg Hsg DR FL Polz 60Ckt

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In Stock: 979

Stock:
979 Can Dispatch Immediately
Quantities greater than 979 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,95 € 1,95 €
1,69 € 42,25 €
1,66 € 166,00 €
1,63 € 326,00 €
1,60 € 960,00 €
1,57 € 4.082,00 €
1,56 € 7.800,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Wire Housings
Receptacle Housing
60 Position
2.54 mm (0.1 in)
2 Row
Cable Mount / Free Hanging
Crimp
Socket (Female)
90160
C-Grid
Wire-to-Board, Signal
- 55 C
+ 105 C
Bulk
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: SG
Housing Colour: Black
Housing Material: Polyphenylene Oxide (PPO)
Product Type: Headers & Wire Housings
Factory Pack Quantity: 200
Subcategory: Headers & Wire Housings
Part # Aliases: 0901600160
Unit Weight: 4,190 g
Products found:
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Attributes selected: 0

TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8538903900
USHTS:
8538906000
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.