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90156-0156

Name: Molex 90156-0156
Brand: Molex
SKU: 538-90156-0156
Price: 1.42 EUR
Availability: InStock

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Mouser No:

538-90156-0156

Mfr. No:

90156-0156

Mfr.:

Molex

Description:

Headers & Wire Housings 2.54MM CGRIDIII HSG 16P SR CRIMP

Datasheet:

90156-0156 Datasheet

ECAD Model:

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More Information

Learn more about Molex 90156-0156

In Stock: 2.064

Stock:: 2.064 Can Dispatch Immediately

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	1,42 €	1,42 €
	1,25 €	12,50 €
	1,16 €	116,00 €
	1,09 €	272,50 €
	0,726 €	363,00 €
	0,713 €	713,00 €
	0,693 €	1.732,50 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Wire Housings
Type:	Receptacle Housing
Number of Positions:	16 Position
Pitch:	2.54 mm (0.1 in)
Number of Rows:	1 Row
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Contact Gender:	Socket (Female)
Series:	90156
Tradename:	C-Grid
Application:	Wire-to-Board, Signal
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Brand:	Molex
Current Rating:	3 A
Housing Colour:	Black
Housing Material:	Polyphenylene Oxide (PPO)
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	2500
Subcategory:	Headers & Wire Housings
Part # Aliases:	0901560156
Unit Weight:	1,218 g

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Datasheet

90156-0156 Datasheet

Models

RoHS Certificate (PDF)

Compliance Codes

TARIC:: 8536699099
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8538906000
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Singapore
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3^rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.