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90131-0133

Name: Molex 90131-0133
Brand: Molex
SKU: 538-90131-0133
Price: 1.92 EUR
Availability: InStock

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Mouser No:

538-90131-0133

Mfr. No:

90131-0133

Mfr.:

Molex

Description:

Headers & Wire Housings 2.54MM CGRIDIII HDR 26P VERT DR TIN

Datasheet:

90131-0133 Datasheet

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Learn more about Molex 90131-0133

In Stock: 848

Stock:: 848 Can Dispatch Immediately

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	1,92 €	1,92 €
	1,63 €	16,30 €
	1,49 €	37,25 €
	1,38 €	138,00 €
	1,23 €	590,40 €
	1,17 €	1.310,40 €
	1,09 €	2.790,40 €
	1,02 €	5.222,40 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Breakaway
Number of Positions:	26 Position
Pitch:	2.54 mm (0.1 in)
Number of Rows:	2 Row
Row Spacing:	2.54 mm (0.1 in)
Mounting Style:	Through Hole
Termination Style:	Solder Pin
Mounting Angle:	Straight
Contact Gender:	Pin (Male)
Contact Plating:	Tin
Mating Post Length:	6.75 mm (0.266 in)
Termination Post Length:	2.9 mm (0.114 in)
Series:	90131
Tradename:	C-Grid
Application:	Wire-to-Board, Signal
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Current Rating:	3 A
Housing Colour:	Black
Housing Material:	Polyester
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	160
Subcategory:	Headers & Wire Housings
Voltage Rating:	350 V
Part # Aliases:	0901310133
Unit Weight:	1,586 g

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Compliance Codes

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Indonesia
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3^rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.