90123-0119

Molex
538-90123-0119
90123-0119

Mfr.:

Description:
Headers & Wire Housings 2.54MM CGRIDIII HSG 19P SR W/2POL BTTN

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,705 € 0,71 €
0,615 € 6,15 €
0,562 € 14,05 €
0,561 € 56,10 €
0,525 € 1.260,00 €
0,501 € 3.006,00 €
0,476 € 5.140,80 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Wire Housings
Receptacle Housing
19 Position
2.54 mm (0.1 in)
1 Row
Cable Mount / Free Hanging
Crimp
Socket (Female)
90123
C-Grid
- 55 C
+ 105 C
Bulk
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: IE
Flammability Rating: UL 94 V-1
Housing Colour: Black
Housing Material: Polyphenylene Oxide (PPO)
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1
Subcategory: Headers & Wire Housings
Part # Aliases: 0901230119
Unit Weight: 1,096 g
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Attributes selected: 0

TARIC:
8536699099
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8538906000
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.