78353-1011

Molex
538-78353-1011
78353-1011

Mfr.:

Description:
High Speed/Modular Connectors Impact Pwr 6Pr RAHdr L/HdnPF.76AuLF 8Ckt

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 176   Multiples: 88
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
19,74 € 3.474,24 €
18,64 € 4.920,96 €
18,10 € 9.556,80 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Connector Modules
12 Position
3 Row
5.2 mm
Through Hole
Gold
78353
Brand: Molex
Contact Material: Tin
Current Rating: 20 A
Housing Colour: Black
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Right Angle
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 22
Subcategory: Backplane Connectors
Tradename: Impact
Voltage Rating: 250 V
Part # Aliases: 783531011 0783531011
Unit Weight: 35,079 g
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Attributes selected: 0

Compliance Codes
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
Indonesia
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.