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76155-3607

Name: Molex 76155-3607
Brand: Molex
SKU: 538-76155-3607
Price: 25.12 EUR
Availability: OutOfStock

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Mouser No:

538-76155-3607

Mfr. No:

76155-3607

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impact BP 4x16 GL Sn Impact BP 4x16 GL Sn

Datasheet:

76155-3607 Datasheet

ECAD Model:

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More Information

Learn more about Molex 76155-3607

Availability

Stock:: 0

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On Order:: 410

Expected 6/9/2026
Factory Lead Time:: 21

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	25,12 €	25,12 €
	21,35 €	213,50 €
	20,01 €	500,25 €
	19,06 €	953,00 €
	17,72 €	1.772,00 €
	16,94 €	4.743,20 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	192 Position
Number of Rows:	12 Row
Pitch:	1.9 mm
Termination Style:	Press Fit
Contact Plating:	Gold
Series:	76155
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Current Rating:	750 mA
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	140
Subcategory:	Backplane Connectors
Tradename:	Impact
Voltage Rating:	30 V
Part # Aliases:	0761553607
Unit Weight:	7,315 g

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Datasheet

76155-3607 Datasheet

Models

PCN

Product Change Notification (PDF)

RoHS Certificate (PDF)

Compliance Codes

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Singapore
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.