75705-1804

Molex
538-75705-1804
75705-1804

Mfr.:

Description:
High Speed/Modular Connectors I-TRAC BP ASSY - 8CO BP ASSY - 8COL OPEN

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
20 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
28,51 € 28,51 €
24,23 € 242,30 €
23,14 € 578,50 €
22,39 € 1.119,50 €
19,84 € 1.428,48 €
19,67 € 5.664,96 €
19,51 € 9.833,04 €
1.008 Quote

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Headers
176 Position
11 Row
1.85 mm
Solder Pin
Gold
75705
Tray
Brand: Molex
Contact Material: Tin
Current Rating: 1 A
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 80 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Vertical
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 72
Subcategory: Backplane Connectors
Tradename: GbX I-Trac
Voltage Rating: 120 VAC/DC
Part # Aliases: 0757051804
Unit Weight: 5,886 g
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Attributes selected: 0

Compliance Codes
TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
Malaysia
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.