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75586-0103

Name: Molex 75586-0103
Brand: Molex
SKU: 538-75586-0103
Price: 7.25 EUR
Availability: InStock

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Mouser No:

538-75586-0103

Mfr. No:

75586-0103

Mfr.:

Molex

Description:

High Speed/Modular Connectors iPass(TM) RA Rec 0.38Au 38 Ckt SR

Datasheet:

75586-0103 Datasheet

ECAD Model:

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More Information

Learn more about Molex 75586-0103

In Stock: 1.650

Stock:: 1.650 Can Dispatch Immediately

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Factory Lead Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	7,25 €	7,25 €
	6,53 €	65,30 €
	6,15 €	153,75 €
	5,99 €	299,50 €
	5,84 €	584,00 €
	5,20 €	1.300,00 €
Full Reel (Order in multiples of 550)
	4,88 €	2.684,00 €
	4,43 €	4.873,00 €
	4,06 €	8.932,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Receptacles
Number of Positions:	38 Position
Number of Rows:	2 Row
Pitch:	0.8 mm
Termination Style:	Solder
Contact Plating:	Gold
Series:	75586
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	500 mA
Maximum Operating Temperature:	+ 80 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	550
Subcategory:	Backplane Connectors
Tradename:	iPass
Voltage Rating:	30 V
Part # Aliases:	0755860103
Unit Weight:	1 g

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Datasheet

75586-0103 Datasheet

Models

PCN

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.