55917-0830

Molex
538-55917-0830
55917-0830

Mfr.:

Description:
Headers & Wire Housings 2.0 WtB Dual Con Dip Plg Hsg Assy 8Ckt

ECAD Model:
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In Stock: 3.020

Stock:
3.020 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,36 € 1,36 €
1,16 € 11,60 €
1,06 € 26,50 €
0,972 € 97,20 €
0,929 € 232,25 €
0,86 € 430,00 €
0,80 € 880,00 €
0,785 € 1.727,00 €
0,74 € 4.070,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Headers
Shrouded
8 Position
2 mm (0.079 in)
2 Row
5 mm (0.197 in)
Through Hole
Solder Pin
Straight
Pin (Male)
Tin
55917
MicroClasp
Wire-to-Board, Signal
- 25 C
+ 105 C
Tray
Brand: Molex
Contact Material: Tin
Current Rating: 3 A
Flammability Rating: UL 94 V-0
Housing Colour: Natural
Housing Material: Polyester
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1100
Subcategory: Headers & Wire Housings
Voltage Rating: 250 V
Part # Aliases: 0559170830
Unit Weight: 806,100 mg
Products found:
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.

MicroClasp Wire-to-Board Connector System

Molex MicroClasp Wire-to-Board Connector System provides space savings and easy mating/unmating compared to similar 2.00 and 2.50mm pitch wire-to-board systems. MicroClasp includes a unique inner positive lock that provides latch protection, secure retention, and an audible mating "click". The terminal design offers low insertion and withdrawal forces and is able to carry 3.0A current in a compact 2.00mm pitch design. Molex MicroClasp system is available in 2-40 circuits in SMT and through-hole designs, and in single- and dual-row versions.