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54550-1671

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See Product Specifications

Mouser No:

538-54550-1671

Mfr. No:

54550-1671

Mfr.:

Molex

Description:

FFC & FPC Connectors 0.5 FPC ZIF Hsg Assy ssy 16Ckt EmbsTp Pkg

Lifecycle:

Obsolete

Datasheet:

54550-1671 Datasheet

ECAD Model:

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Shipping Alert:

Mouser does not presently sell this product in your region.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	FFC & FPC Connectors
Delivery Restrictions:	Mouser does not presently sell this product in your region.
RoHS:
Product:	Board Mount
Number of Positions:	16 Position
Pitch:	0.5 mm
Termination Style:	SMD/SMT
Mounting Angle:	Right Angle
Contact Location:	Top Contact
Contact Plating:	Gold
Current Rating:	500 mA
Series:	54550
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Brand:	Molex
Housing Material:	Thermoplastic (TP)
Mounting Style:	SMD/SMT
Product Type:	FFC & FPC Connectors
Factory Pack Quantity:	3000
Subcategory:	FFC & FPC Connectors
Tradename:	Easy-On
Voltage Rating:	50 V
Part # Aliases:	0545501671
Unit Weight:	86,498 mg

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Datasheet

54550-1671 Datasheet

Models

PCN

Product Change Notification (PDF)

RoHS Certificate (PDF)

Compliance Codes

TARIC:: 8536693000
CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Easy-On FFC/FPC Connectors

Molex Easy-On FFC/FPC Connectors are ideal for tight-packaging applications and come in various pitch options, and include features to meet a wide variety of space and usage needs for applications in all markets. Molex Easy-On FFC/FPC Connectors are available with push and flip-style actuators, which are pre-assembled covers that secure the connection between the FFC/FPC and the connector terminals. Molex is continually developing lower-profile and higher-density versions to meet the downsizing needs of electronic equipment makers.