52610-1971

Molex
538-52610-1971
52610-1971

Mfr.:

Description:
FFC & FPC Connectors 1.0 FPC ZIF SMT ST 1 ST 19Ckt EmbsTp Pkg

Lifecycle:
Factory Special Order:
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ECAD Model:
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Availability

Stock:
Not Available

Pricing (EUR)

Product Attribute Attribute Value Select Attribute
Molex
Product Category: FFC & FPC Connectors
RoHS:  
Board Mount
19 Position
1 mm
SMD/SMT
Vertical
Tin Bismuth over Nickel
1 A
52610
- 40 C
+ 85 C
Actuation Type: ZIF
Brand: Molex
Contact Material: Phosphor Bronze
Flammability Rating: UL 94 V-0
Gender: Female
Housing Colour: Natural
Housing Material: Nylon
Mounting Style: SMD/SMT
Product Type: FFC & FPC Connectors
Factory Pack Quantity: 1000
Subcategory: FFC & FPC Connectors
Voltage Rating: 125 V
Part # Aliases: 0526101971
Unit Weight: 891,600 mg
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Attributes selected: 0

Compliance Codes
TARIC:
8536699099
CNHTS:
8538900000
CAHTS:
8536690090
USHTS:
8536694051
JPHTS:
853669000
KRHTS:
8536699000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
Japan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Easy-On FFC/FPC Connectors 0.50/1mm Pitch Sliders

Molex Easy-On FFC/FPC Connectors 0.50/1mm Pitch Sliders Series feature a market-proven slider locking mechanism and wide circuit options in top, bottom, and vertical contact variations. The wide circuits offer design flexibility for FF/FPC cable routing applications. The miniature FFC/FPC SMT connectors are designed to meet a wide variety of space and application-specific needs. The Sn-Ag-Bi plating reduces and/or prevents the production of tin whiskers, increasing the reliability of the associated parts. These Molex Easy-On connectors offer a compact size for applications with tight packaging requirements. The robust actuator design helps prevent damage caused by extensive testing, cycling, or rough handling. Zero Insertion Force (ZIF) and LIF options enable repeat cycling with minimum wear. Available in a variety of fine-pitch options, the lower-profile and higher-density features meet the downsizing needs of electronic equipment makers.