52559-2352

Molex
538-52559-2352
52559-2352

Mfr.:

Description:
FFC & FPC Connectors Easy-On .50mm Vrt 3.9mm 23Ckt

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 6000   Multiples: 6000
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 1000)
1,37 € 8.220,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: FFC & FPC Connectors
RoHS:  
Connectors
23 Position
0.5 mm
SMD/SMT
Vertical
Gold
500 mA
52559
- 40 C
+ 85 C
Reel
Actuation Type: ZIF
Brand: Molex
Flammability Rating: UL 94 V-0
Gender: Female
Housing Material: Nylon
Mounting Style: Cable
Product Type: FFC & FPC Connectors
Factory Pack Quantity: 1
Subcategory: FFC & FPC Connectors
Voltage Rating: 50 V
Part # Aliases: 525592352 0525592352
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Attributes selected: 0

Compliance Codes
TARIC:
8536693000
USHTS:
8536694040
ECCN:
EAR99
Origin Classifications
Country of Origin:
Japan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Easy-On FFC/FPC Connectors 0.50/1mm Pitch Sliders

Molex Easy-On FFC/FPC Connectors 0.50/1mm Pitch Sliders Series feature a market-proven slider locking mechanism and wide circuit options in top, bottom, and vertical contact variations. The wide circuits offer design flexibility for FF/FPC cable routing applications. The miniature FFC/FPC SMT connectors are designed to meet a wide variety of space and application-specific needs. The Sn-Ag-Bi plating reduces and/or prevents the production of tin whiskers, increasing the reliability of the associated parts. These Molex Easy-On connectors offer a compact size for applications with tight packaging requirements. The robust actuator design helps prevent damage caused by extensive testing, cycling, or rough handling. Zero Insertion Force (ZIF) and LIF options enable repeat cycling with minimum wear. Available in a variety of fine-pitch options, the lower-profile and higher-density features meet the downsizing needs of electronic equipment makers.