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500334-0800

Name: Molex 500334-0800
Brand: Molex
SKU: 538-500334-0800
Price: 2.88 EUR
Availability: InStock

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Mouser No:

538-500334-0800

Mfr. No:

500334-0800

Mfr.:

Molex

Description:

Board to Board & Mezzanine Connectors .5mm Plug 80Ckt

Datasheet:

500334-0800 Datasheet

ECAD Model:

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In Stock: 10.561

Stock:: 10.561 Can Dispatch Immediately

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Factory Lead Time:: 20 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	2,88 €	2,88 €
	2,62 €	26,20 €
	2,49 €	62,25 €
	2,30 €	230,00 €
	2,02 €	505,00 €
	1,96 €	980,00 €
	1,71 €	1.710,00 €
Full Reel (Order in multiples of 3000)
	1,63 €	4.890,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Headers
Number of Positions:	80 Position
Pitch:	0.5 mm (0.02 in)
Number of Rows:	2 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Stack Height:	2.5 mm
Current Rating:	500 mA
Voltage Rating:	50 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Contact Plating:	Gold
Contact Material:	Brass
Housing Material:	Thermoplastic (TP)
Series:	500334
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Molex
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	3000
Subcategory:	Board to Board & Mezzanine Connectors
Part # Aliases:	5003340800 05003340800
Unit Weight:	255 mg

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Attributes selected: 0

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Compliance Codes

TARIC:: 8536693000
CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.