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45971-2385

Name: Molex 45971-2385
Brand: Molex
SKU: 538-45971-2385
Price: 17.46 EUR
Availability: InStock

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Mouser No:

538-45971-2385

Mfr. No:

45971-2385

Mfr.:

Molex

Description:

Board to Board & Mezzanine Connectors SeaRay Recpt 08x20x6.6 Tin

Datasheet:

45971-2385 Datasheet

ECAD Model:

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In Stock: 304

Stock:: 304 Can Dispatch Immediately

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	17,46 €	17,46 €
	15,14 €	151,40 €
	14,34 €	358,50 €
	14,14 €	707,00 €
	12,48 €	1.248,00 €
Full Reel (Order in multiples of 260)
	10,71 €	2.784,60 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Receptacles
Number of Positions:	160 Position
Pitch:	1.27 mm (0.05 in)
Number of Rows:	8 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Stack Height:	6.6 mm
Current Rating:	2.7 A
Voltage Rating:	240 VAC
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper
Housing Material:	Thermoplastic (TP)
Series:	45971
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Molex
Flammability Rating:	UL 94 V-0
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	260
Subcategory:	Board to Board & Mezzanine Connectors
Part # Aliases:	0459712385
Unit Weight:	2,170 g

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Datasheet

45971-2385 Datasheet

PCN

RoHS Certificate (PDF)

Compliance Codes

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.