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218877-0062

Name: Molex 218877-0062
Brand: Molex
SKU: 538-218877-0062
Price: 1.55 EUR
Availability: OutOfStock

Mouser No:

538-218877-0062

Mfr. No:

218877-0062

Mfr.:

Molex

Description:

Board to Board & Mezzanine Connectors 0.35 BB 6+2RF PLG ASSY 25

Datasheet:

218877-0062 Datasheet

ECAD Model:

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Availability

Stock:: Non-Stocked

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Minimum: 88000 Multiples: 88000

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	1,55 €	136.400,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Connectors
Number of Positions:	6 Position
Pitch:	0.35 mm (0.014 in)
Number of Rows:	2 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Current Rating:	1 A, 3 A
Voltage Rating:	50 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Contact Plating:	Gold
Contact Material:	Copper
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	218877
Brand:	Molex
Mounting Style:	PCB Mount
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	1
Subcategory:	Board to Board & Mezzanine Connectors
Part # Aliases:	2188770062 02188770062

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Technical Resources

Compliance Codes

USHTS:: 8536694040

Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

5G Technology

Molex 5G Technology includes optical, copper, RF connectivity, FPGA solutions, and signal integrity engineering. The Molex 5G Technology components enable 5G networks and deliver increased bandwidth for higher data rates at a lower latency.

5G25 RF Connectors

Molex 5G25 RF Connectors are flex-to-board connectors with a shield design that supports the use of high-frequency signals (up to 25GHz) and reduces EMI. The 5G25 series enables designers of RF antenna modules and mobile devices to combine RF and non-RF signals, which reduces the need for additional connectors. Molex 5G25 RF Connectors offer high signal integrity (SI) performance for high-speed, extreme RF applications, along with robust mating features and the small size necessary for compact 5G mobile and other communication devices.