218216-0802

Molex
538-218216-0802
218216-0802

Mfr.:

Description:
Headers & Wire Housings Micro-fit+DR SMT RA Nail 8CKT 30Au

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
17 Weeks Estimated factory production time.
Minimum: 7000   Multiples: 1400
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
12,37 € 86.590,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
218216
Micro-Fit+
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1400
Subcategory: Headers & Wire Housings
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Attributes selected: 0

Datasheet

Glow Wire Micro-Fit+ Connectors

Molex Glow Wire Micro-Fit+ Connectors offer a 3mm pitch, a high current rating of 13A, and are glow wire capable. These connectors feature fully isolated contacts on each side of the interface to help prevent potential arcing, a unique keying design to prevent mismating, and a small PCB footprint that provides design flexibility. The surface-mount technology (SMT) and through-hole technology (THT) headers offer flexibility in PCB designs, with clip and nail SMT options available for improved strength and reliability. Molex Glow Wire Micro-Fit+ Connectors are suitable for various environments, including consumer, medical, automotive, sustainable energy, and telecommunications.

Micro-Fit+ Connectors

Molex Micro-Fit+ Connectors offer superior design options for flexibility and efficient assembly. The connectors offer a high current rating of up to 13.5A with a 3mm pitch and use the same amount of space that smaller connectors occupy. Features include a smaller PCB footprint, a reduced mating force of 40%, and an enhanced TPA design that provides stability and security for the terminals inside the receptacle. Molex Micro-Fit+ applications include consumer, telecommunication/networking, medical, sustainable energy, and automotive.

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